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Table 1 Preparation parameters for the grinding of the cross-sections

From: Applying microscopic analytic techniques for failure analysis in electronic assemblies

Step 1 2 3 4
Abrasive SiC
320
SiC
1200
SiC
2000
SiC
4000
Suspension Water Water Water Water
Rotations per minute 300 300 300 300
Force (N)/specimen 20 20 20 20
Time (min) * * * *
  1. * Depending on sample material and its grinding behavior