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Table 1 Preparation parameters for the grinding of the cross-sections

From: Applying microscopic analytic techniques for failure analysis in electronic assemblies

Step

1

2

3

4

Abrasive

SiC

320

SiC

1200

SiC

2000

SiC

4000

Suspension

Water

Water

Water

Water

Rotations per minute

300

300

300

300

Force (N)/specimen

20

20

20

20

Time (min)

*

*

*

*

  1. * Depending on sample material and its grinding behavior