Table 1 Procedures of mechanical polishing for copper foil preparation
From: Microstructure analysis of 8 μm electrolytic Cu foil in plane view using EBSD and TEM
Surface | Abrasive | Time (min) | Platen Speed (RPM), mode | Sample Speed (RPM) | Remarks | |
|---|---|---|---|---|---|---|
1 | #2400 | Silicon Carbide | 5 | 300, comp | 150 | Water spray |
2 | Gold label | 3 μm Polycrystalline Diamond suspension | 5 | 150, comp | 150 | Abrasive spray per 10 s |
3 | Final A | 0.04 μm Colloidal Silica | 20 | 150, comp | 150 | Abrasive spray per 6 s Water cleaning for 60 s before finish |