Fig. 6From: Automated measurement and analysis of sidewall roughness using three-dimensional atomic force microscopyThe 15 repetitive measurements of SWR on point 1, 2, and 3, randomly selected from three locations on the wafer dies. a The die map of the color scale regarding the average measurement result. b Average and standard deviation results of SWR. c Line profile for each measuring point. d AFM images after first order flattening of line scan directionBack to article page