Fig. 5

Transferring process of YAlO₃ pre-milled FIB sample on MEMS window from Cu grid a 53 degree tilted SEM image of YAlO₃ FIB sample. Red squared part shows cut FIB side by 30 kV accelerated Ga⁺ ion. b Transferring process observed by optical microscopy in real time using tip of radius < 1000 nm. c TEM image of transferred YAlO₃ FIB sample on MEMS window. The inset shows low magnification TEM image of sample. d SAED pattern of red circled part in c