Fig. 6From: The LaserFIB: new application opportunities combining a high-performance FIB-SEM with femtosecond laser processing in an integrated second chamber3D X-ray image of a < 1 mm field-of-view of package interconnect structures within an AMD Vega64 2.5D package. Acquired with ZEISS Xradia 620 Versa using 0.7 μm voxel sizeBack to article page